Cementation of copper onto zinc metal from sulphate solution has been examined through measurement of electrochemical parameters. Both dynamic and steady-state polarization plots have been generated for anodic and cathodic half cell reactions and superimposed on one another to obtain the mixed potential and the mixed current. Both the processes of copper cementation as well as hydrogen reduction have been studied. Kinetic equations have been developed for both the processes and mechanistic conclusions have been drawn. Copper cementation has been found to be under diffusion regime, whereas, hydrogen reduction is controlled by surface elecrochemical reaction.
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