| dc.contributor.author |
Mishra, K.G. |
|
| dc.contributor.author |
Paramguru, R.K. |
|
| dc.date.accessioned |
2018-10-01T12:20:28Z |
|
| dc.date.available |
2018-10-01T12:20:28Z |
|
| dc.date.issued |
1997 |
|
| dc.identifier.citation |
Metals Materials And Processes, 9(1), 1997: 15-23 |
|
| dc.identifier.issn |
0970-423X |
|
| dc.identifier.uri |
http://ore.immt.res.in/handle/2018/674 |
|
| dc.description.abstract |
The effect of moderate copper and low formaldehyde concentrations on electroless deposition of copper has been studied using potentiostatic and steadystate polarization technique. An attempt has been made to measure the mixed potential and mixed current by plotting polarization plots for the individual anodic and cathodic half cell reactions. The actual deposition rate was also determined experimentally and compared with the mixed current. The position of mixed potential, E-m was found to occur on the cathodic Tafel and anodic limiting current regions indicating the process to be anodic diffusion controlled. A kinetic expression derived, based on corrosion coupling principles explained the experimental observations. |
|
| dc.language |
en |
|
| dc.publisher |
Meshap Science Publishers |
|
| dc.relation.isreferencedby |
SCI |
|
| dc.rights |
Copyright [1997]. All efforts have been made to respect the copyright to the best of our knowledge. Inadvertent omissions, if brought to our notice, stand for correction and withdrawal of document from this repository. |
|
| dc.subject |
Materials Sciences |
|
| dc.subject |
Materials Sciences |
|
| dc.subject |
Materials Sciences |
|
| dc.title |
Kinetics and mechanism of electroless deposition of copper at moderate copper and low formaldehyde concentrations |
|
| dc.type |
Journal Article |
|
| dc.affiliation.author |
CSIR-IMMT, Bhubaneswar 751013, Odisha, India |
|