| dc.contributor.author |
Pradhan, N. |
|
| dc.contributor.author |
Krishna, P.G. |
|
| dc.contributor.author |
Das, S.C. |
|
| dc.date.accessioned |
2018-10-01T12:20:00Z |
|
| dc.date.available |
2018-10-01T12:20:00Z |
|
| dc.date.issued |
1996 |
|
| dc.identifier.citation |
Plating And Surface Finishing, 83(3), 1996: 56-& |
|
| dc.identifier.issn |
0360-3164 |
|
| dc.identifier.uri |
http://ore.immt.res.in/handle/2018/547 |
|
| dc.description.abstract |
A study was made to determine the effect of chloride ion during electrodeposition of copper, using an open-channel cell, Electrolysis parameters, such as current density, copper concentration, temperature, and circulation rate were varied in the presence of chloride ion to determine their effect, The deposits were examined by scanning electron microscopy (SEM) and X-ray diffractometry (XRD) to determine morphology and crystallographic orientations, It was observed that chloride ion affects the quality of the deposit surface, crystallographic orientations and deposit morphology of cathode copper, These are further affected by changing the electrolysis parameters. |
|
| dc.language |
en |
|
| dc.publisher |
American Electroplaters And Surface Finishers Society |
|
| dc.relation.isreferencedby |
SCI |
|
| dc.rights |
Copyright [1996]. All efforts have been made to respect the copyright to the best of our knowledge. Inadvertent omissions, if brought to our notice, stand for correction and withdrawal of document from this repository. |
|
| dc.subject |
Materials Sciences |
|
| dc.subject |
Materials Sciences |
|
| dc.subject |
Materials Sciences |
|
| dc.title |
Influence of chloride ion on electrocrystallization of copper |
|
| dc.type |
Journal Article |
|
| dc.affiliation.author |
CSIR-IMMT, Bhubaneswar 751013, Odisha, India |
|